NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING HO WAH GENTING BERHAD ("HWGB" OR THE "COMPANY") PRIVATE PLACEMENT OF UP TO 34,241,766 NEW ORDINARY SHARES OF HWGB ("HWGB SHARE(S)" OR "SHARE(S)") REPRESENTING APPROXIMATELY TEN PERCENT (10%) OF THE TOTAL NUMBER OF ISSUED SHARES OF HWGB ("PRIVATE PLACEMENT")

HO WAH GENTING BERHAD

Type Announcement
Subject NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS)
FUND RAISING
Description
HO WAH GENTING BERHAD ("HWGB" OR THE "COMPANY")

PRIVATE PLACEMENT OF UP TO 34,241,766 NEW ORDINARY SHARES OF HWGB ("HWGB SHARE(S)" OR "SHARE(S)") REPRESENTING APPROXIMATELY TEN PERCENT (10%) OF THE TOTAL NUMBER OF ISSUED SHARES OF HWGB ("PRIVATE PLACEMENT")

Unless otherwise stated, all capitalised terms set out herein shall have the same meanings as those set out in HWGB’s announcements dated 4 January 2019, 16 January 2019 and 17 January 2019 in relation to the Private Placement (“Announcements”).

On behalf of the Board, Kenanga IB wishes to announce that the Board has on 7 March 2019 fixed the issue price for the first tranche of the Private Placement of 32,460,000 Placement Shares (“First Tranche Private Placement”) at RM0.090 each.

The issue price of the First Tranche Private Placement of RM0.090 represents a discount of approximately RM0.0087 or 8.81% over the 5-day VWAMP of HWGB Shares up to and including 6 March 2019 of RM0.0987 per HWGB Share.

This announcement is dated 7 March 2019.






Announcement Info

Company Name HO WAH GENTING BERHAD
Stock Name HWGB
Date Announced 07 Mar 2019
Category General Announcement for PLC
Reference Number GA1-07032019-00076