NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING PROPOSED PRIVATE PLACEMENT OF UP TO 17,961,474 NEW ORDINARY SHARES OF RM0.10 EACH IN M3TECH ("M3TECH SHARES") ("PLACEMENT SHARES"), REPRESENTING UP TO TEN PERCENT (10%) OF THE ISSUED AND PAID-UP SHARE CAPITAL OF M3TECH ("PROPOSED PRIVATE PLACEMENT")

M3 TECHNOLOGIES (ASIA) BERHAD

Type Announcement
Subject NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS)
FUND RAISING
Description
PROPOSED PRIVATE PLACEMENT OF UP TO 17,961,474 NEW ORDINARY SHARES OF RM0.10 EACH IN M3TECH ("M3TECH SHARES") ("PLACEMENT SHARES"), REPRESENTING UP TO TEN PERCENT (10%) OF THE ISSUED AND PAID-UP SHARE CAPITAL OF M3TECH ("PROPOSED PRIVATE PLACEMENT")

Unless otherwise stated, all definitions and terms used in this announcement shall have the same meanings as defined in the previous announcements.

Reference is made to the announcements dated 17 February 2015, 2 March 2015 and 17 March 2015 in relation to the Proposed Private Placement.

On behalf of the Board of M3Tech (“Board”), PIVB wishes to announce that the Board has on today fixed the issue price for the placement of 6,000,000 new M3Tech Shares (“Price-Fixing Date”), being the first (1st) tranche of the Proposed Private Placement at RM0.13 per Placement Share (“1st Issue Price”).

The 1st Issue Price represents a discount of approximately 4.2% to the five (5)-day VWAP of M3Tech Shares up to and including 5 June 2015, being the market day immediately preceding the Price-Fixing Date, of RM0.1357 per M3Tech Share.

This announcement is dated 8 June 2015.






Announcement Info

Company Name M3 TECHNOLOGIES (ASIA) BERHAD
Stock Name M3TECH
Date Announced 08 Jun 2015
Category General Announcement for PLC
Reference Number GA1-08062015-00007